JPH0180784U - - Google Patents
Info
- Publication number
- JPH0180784U JPH0180784U JP1987176319U JP17631987U JPH0180784U JP H0180784 U JPH0180784 U JP H0180784U JP 1987176319 U JP1987176319 U JP 1987176319U JP 17631987 U JP17631987 U JP 17631987U JP H0180784 U JPH0180784 U JP H0180784U
- Authority
- JP
- Japan
- Prior art keywords
- crimp
- crimping
- tooth shape
- guide walls
- tooth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176319U JPH0180784U (en]) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176319U JPH0180784U (en]) | 1987-11-18 | 1987-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0180784U true JPH0180784U (en]) | 1989-05-30 |
Family
ID=31468060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987176319U Pending JPH0180784U (en]) | 1987-11-18 | 1987-11-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0180784U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06260258A (ja) * | 1993-03-08 | 1994-09-16 | Sumitomo Wiring Syst Ltd | 端子圧着方法及びその方法に用いる圧着端子並びに圧着装置 |
JP2012022930A (ja) * | 2010-07-15 | 2012-02-02 | Yazaki Corp | 金型及び圧着方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148681B2 (en]) * | 1980-03-27 | 1986-10-25 | Nippon Denshin Denwa Kk |
-
1987
- 1987-11-18 JP JP1987176319U patent/JPH0180784U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148681B2 (en]) * | 1980-03-27 | 1986-10-25 | Nippon Denshin Denwa Kk |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06260258A (ja) * | 1993-03-08 | 1994-09-16 | Sumitomo Wiring Syst Ltd | 端子圧着方法及びその方法に用いる圧着端子並びに圧着装置 |
JP2012022930A (ja) * | 2010-07-15 | 2012-02-02 | Yazaki Corp | 金型及び圧着方法 |
CN103004038A (zh) * | 2010-07-15 | 2013-03-27 | 矢崎总业株式会社 | 压模组件及压接方法 |
CN103004038B (zh) * | 2010-07-15 | 2015-04-29 | 矢崎总业株式会社 | 压模组件及压接方法 |
US9106040B2 (en) | 2010-07-15 | 2015-08-11 | Yazaki Corporation | Die assembly and crimping method |
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